Hou Yung-Chin
SVP and Deputy Co-COO
Hou Yung-Chin has filed 7 SEC Form 4 filings (7 transaction rows) across 1 company, with disclosures dating back to 2026. 7 of those filings fall inside the rolling window. Most recent filing: Sep 9, 2026.
On the most recent filing, Hou Yung-Chin is listed as SVP and Deputy Co-COO at TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD. Inside the rolling window, Hou Yung-Chin reported 6 open-market purchases totaling $28K in TSM and no open-market sales. The largest disclosed transaction in the window is a purchase of 66 TSM shares on May 8, 2026, worth $5K.
Companies traded
Other insiders at TSM
Insider Buying
$28K
reported purchases (SEC code P)
Insider Selling
$0
reported sales (SEC code S)
Companies
1
in the rolling window
Frequently asked questions
How many SEC Form 4 filings has Hou Yung-Chin made?
Hou Yung-Chin has filed 7 SEC Form 4 filings (7 transaction rows) across 1 company since 2026.
Which companies does Hou Yung-Chin trade?
Hou Yung-Chin has filed SEC Form 4 disclosures for 1 company, including TSM.
When was Hou Yung-Chin's most recent SEC Form 4 filing?
Hou Yung-Chin's most recent SEC Form 4 filing on Tracefour is dated Sep 9, 2026.
What is Hou Yung-Chin's job title?
On the most recent SEC Form 4 filings tracked by Tracefour, Hou Yung-Chin is listed as SVP and Deputy Co-COO.
What is Hou Yung-Chin's total buy and sell value in the current window?
Inside the rolling retention window, Hou Yung-Chin bought $28K and sold $0 based on SEC Form 4 filings.
What was Hou Yung-Chin's largest disclosed transaction?
The largest disclosed transaction in the current window is a purchase of 66 TSM shares on 2026-05-08, worth $5K, per SEC Form 4 filings.